Stop by KGS America’s booth #3346 at OFC on 3/7-9, 2023
OFC is the largest global conference and exhibition for optical communications and networking professionals. The program is comprehensive — from research to marketplace, from components to systems and networks and from technical sessions to the exhibition. OFC draws attendees from all corners of the globe to meet and greet, teach and learn, make connections and move the industry forward.
About Venue
OFC, the premier event in telecom and data center optics, will take place Tuesday, 7 March to Thursday, 9 March 2023. (Exhibition dates). The venue will be at the San Diego Convention Center. Health and safety measures will be implemented at the San Diego Convention Center and all associated properties.
San Diego Convention Center
111 W Harbor Drive
San Diego, CA 92101
KITAGAWA INDUSTRIES America is featuring the following products at this OFC 2023.
KGS America Inc. Exhibitor Booth #3346
Four product types related to optical communications and networking professionals applications (EMI Ferrite / Ferrite Core, Thermal Pads, EMI Grounding, Vibration Damping Materials) are introduced here. Please feel free to contact us as there are many related products other than these products.
Putty does not drip even when thickly applied. Extremely useful in filling gaps with varying component heights. Very little compressive force on sensitive IC components and PCBs. No pre-mixing required! Putty is supplied ready to dispense. Automated dispensing possible with coating machine
Silicone-free base, great for any device, especially for sensitive optical applications
Super compliable (ASKER C 0) material sandwiched between thin permanent PET film and light tacky layer for easy handling. Thin permanent PET film provides mechanical strength and prevents dust and debris from getting trapped on the putty surface. Because the CPVP is so soft, very little pressure is applied to components. No concerns for siloxane outgassing or oil bleeding. Operating temperature: -40 ~ 125˚C
KITAGAWA INDUSTRIES America carries a large selection of onboard contacts (OG) that are excellent grounding materials for reducing EMI noise at the board level. Also, these parts give the ability to ground in the areas where screws are not used. Space saving, FG facilitated even where screws are precluded. Automated mounting on PC board is applicable. Box structure is introduced for distortion, deformation and damage prevention.(excluding some part numbers)
Achieve high attenuation of microwave noise problems at a specific high frequency, as much as 20dB. Recommended to have a reflective metal surface on the other side of the absorber. No fixture is necessary, adhesive on one side for easy mounting onto chip. Available without pressure-sensitive tape. Custom profile available upon request.
LESSMIRROR is thin and light, EM wave absorber with narrow GHz band. It has effective noise suppression in GHz band and lighter than conventional rubber absorber due to paper used as the main material, and also thin and suitable for small equipment.
Please feel free to contact us with any questions regarding the above products. There is live chat on this site.
