Silicone‐Free Thermal Pad: CPVS Series
Soft (ASKER C 18) silicone-free thermal pad
Many optical, medical, and sensor applications cannot allow silicone particles to be located within their enclosures. To meet the needs of these industries, KITAGAWA INDUSTRIES America offers a line of non-silicone based thermal pads/Thermal Interface Materials (TIM) to eliminate any worries regarding siloxane gasses. These are available in thermal conductivity between 2.0 W/m*K. Like silicone based thermal pads, self-tackiness on both sides and one side self-tackiness are available as options. Available thicknesses range from 0.5 – 2.0 mm.
Structure
Features
Soft type thermal pads provide low thermal resistance, while conforming well to uneven surfaces.
Soft type thermal pads more evenly distribute pressure.
Typical Properties
Property | Test Method | CPVS-F | CPVS |
---|---|---|---|
Thickness | – | 0.3, 0.5, 1.0, 1.5, 2.0, 2.5 | 1.0, 1.5, 2.0, 2.5 |
Standard Sheet Size | – | 210 x 510 | 210 x 510 |
Thermal Conductivity (W/m・K) | JIS R 2616 (hot wire method) |
2.0 | 2.0 |
Specific Gravity | JIS Z 8807 | 1.94 | 1.94 |
Hardness (ASKER C) | JIS K 7312 | 18 | 18 |
Tensile Strength (MPa) | JIS K 6251 | 0.32 | 0.16 |
Elonga on (mm) | JIS K 6251 | 5.38 | 177.5 |
Volume Resistivity (Ω・cm) | JIS K 6911 (compliant) |
5.3x 10¹¹ | 5.3x 10¹¹ |
Breakdown Voltage (kV/mm) | JIS C 2110-1 (compliant) |
4.3 | 3.9 |
Withstanding Voltage (kV/mm) | JIS C 2110-1 (compliant) |
2.8 | 2.2 |
Dielectric Constant (1 MHz) | Company Standard | 12.1 | 14.4 |
Loss Tangent (1 MHz) | Company Standard | 0.08 | 0.07 |
Flame Resistance | UL94 | V-2 (t0.5 – 2mm) | V-2 (t0.5 – 2mm) |
Loss Factor | Measured by FWHM method | 0.9 | 0.9 |
Operating Temperature (°C) | – | -40 ~ 100 | -40 ~ 100 |
Color | – | Green | Green |
* Specifications and dimensions are subject to change without notice for product improvement.