Silicone Free Thermal Pad: CPVH Series
Soft, 3W/m・K silicone-free thermal pad for high operating temperature applications.
Structure
Compression Rate vs. Thermal Resistance
Typical Properties
Property | Test Method | CPVH-F | CPVH |
---|---|---|---|
Thickness | – | 0.5, 1.0, 1.5, 2.0, 2.5, 3.0, 3.5, 4.0 | 2.0, 3.0, 4.0 |
Standard sheet size | – | 210 x 510 | |
Thermal Conductivity (W/m・K) | JIS R 2616 Hot-wire method |
3.0 | |
ISO 22007-2 Hot-disc method |
2.2 | ||
ASTM D5470 | 2.6 | ||
Hardness (ASKER C) | JIS K 7312 | 15 | |
Hardness (Shore 00) | ASTM D 2240 | 47 | |
Volume Resistivity (Ω・cm) | JIS K 6911 | 1.0 X 10¹¹ | |
Flame Resistance | UL94 | V-0 | |
Operating Temperature (°C) | – | -40 ~ 125 | |
Color | – | Brown | |
Specific Gravity | JIS Z 8807 | 2.33 | |
Tensile Strength (MPa) | JIS K 6251 | 0.25 | 0.15 |
Elongation Rate (%) | JIS K 6251 | 11 | 200 |
Breakdown Voltage (kV/mm) | JIS C 2110-1 | 2.7 | 3.1 |
Withstanding Voltage (kV/mm) | JIS C 2110-1 | 2.1 | 1.9 |
Dielectric Constant (1 MHz) | Company Standard | 18.2 | 19.6 |
Loss Tangent (1 MHz) | Company Standard | 0.08 |
Unit:mm
* Specifications and dimensions are subject to change without notice for product improvement.