Silicone Free Thermal Pad: CPSH Series
Soft, 5W/m•K silicone-free thermal pad for high operating temperature applications.
Structure
Compression Rate vs. Thermal Resistance
Typical Properties
Item | Test Method | CPSH-F | CPSH |
---|---|---|---|
Thickness | – | 0.5, 1.0, 1.5, 2.0, 2.5, 3.0, 3.5, 4.0 | 1.0, 1.5, 2.0, 2.5, 3.0, 3.5, 4.0 |
Standard Sheet Size | – | 210 x 510 | |
Thermal Conductivity (W/m・K) | JIS R 2616 Hot-wire method | 5.0 | |
ISO 22007-2 Hot-disc method | 3.7 | ||
Hardness (ASKER C) | JIS K 7312 | 32* *0.5F: ASKER C 55 |
32 |
Hardness (Shore 00) | *ASTM D 2240 | 64 | |
Volume Resistivity (Ω・cm) | JIS K 6911 | 1.0 X 10¹¹ | |
Flame Resistance | UL94 | V-0 | V-0 Equivalent |
Operating Temperature (°C) | – | -40 ~ 125 | |
Color | – | Light Green | |
Specific Gravity | JIS Z 8807 | 2.89 | |
Tensile Strength (MPa) | JIS K 6251 | 0.37 | 0.21 |
Elongation Rate (%) | JIS K 6251 | 28 | 55 |
Breakdown Voltage (kV/mm) | JIS C 2110-1 | 2.2 | 2.0 |
Withstanding Voltage (kV/mm) | JIS C 2110-1 | 1.4 | 1.2 |
Dielectric Constant | Company Standard | 18.2 | 18.8 |
Loss Tangent (1 MHz) | Company Standard | 0.01 |
Unit:mm
* Specifications and dimensions are subject to change without notice for product improvement.