Dual Function Noise Suppression Thermal Pad : CPLK Series

Noise suppression thermally conductive sheet

  • CPLK’s low permittivity 14.6/1MHz has a significant effect on noise reduction

  • Low-dielectric thermally conductive sheet helps to reduce noise in GHz bands, which occurs by heat sink’s resonance phenomena

  • Silicone-free generates no siloxane gas and oil bleeding

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Cross-section view

Resonance Phenomena

Comparison with sheet TIMs

* Please request for detailed product specification data prior to purchase

Properties

Part Number CPLK-F
Thickness (mm) 1.0,1.5,2.0
Available Max Dimension** (mm) 200 x 500
Thermal Conductivity (W/m•K)*JIS R 2616 Hot-wire method 2.0
Thermal Conductivity (W/m•K)*ISO22007-2 Hot-disc method 1.4
Hardness (ASKER C)*JIS K 7312 30
Hardness (Shore 00)*ASTM D 2240 60
Tensile Strength (MPa)*JIS K 6251 0.39
Elongation Rate (%)*JIS K 6251 9.1
Volume Resistivity (Ω•cm)*JIS K 6911 1.0 x 10¹¹
Flame Resistance*UL94 V-0 equivalent
Operating Temperature (°C) -40 ~ 125
Color Mauve
Loss Tangent (500 MHz)*Company Standard 0.17
Loss Tangent (1 GHz)*Company Standard 0.13
Relative Permittivity (500 MHz)*Company Standard 4.51
Relative Permittivity (1 GHz)*Company Standard 4.46
Breakdown Voltage (kV/mm)*JIS C 2110-1 6.6
Withstanding Voltage (kV/mm)*JIS C 2110-1 3.0
Specific Gravity*JIS Z 8807 2.0

Effects of Dielectric (measured)