On‐board Contact for Parallel EMC Grounding: OG-503253-A

SMT grounding contact for engine compartment PCB.

  • Spring mechanism capable of withstanding 10 million deflections caused by engine vibration.
  • Sustained conduction is secured because of unique dimple design.
  • Can be used under high temperature at 150 ºC.

* Specifications and dimensions are subject to change without notice for product improvement.

Advancements in communication technologies have made it possible to transmit more data at high speeds, allowing industrial equipment to perform simple to complex tasks. In addition, the introduction of Artificial Intelligence (AI) in the factory setting is being considered to further improve productivity.