On‐board Contact for Parallel EMC Grounding: OG‐321605G

Onboard grounding component designed for small gaps.

  • Low profile contact designed for space conscious applications
  • Spring force ensures contact to bounce back to its original height after being fully compressed
  • Recommended height: 0.35mm or less
  • Applications include mobile devices and wearable gear
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On‐board Contact for Parallel EMC Grounding: OG‐321605G
Applications SMT spring contact
Recommended Gap (mm) 0.35 or less
Material Phosphor bronze
Surface Treatment Au pla􀆟ng* (Ni undercoat)
Operating Temperature (°C) -40 ~ 85
*Surfaces for contact and soldering

Dimensions (mm)

OG-321605G: Dimensions

Pad and Mask Dimensions (mm)

OG-321605G: Pad and Mask Dimensions

Repetitive Compression Set

OG-321605G: Repetitive Compression Set

Compression Force vs. Electric Resistance

OG-321605G: Compression Force vs. Electric Resistance
OG-321605G: Application Examples

* Specifications and dimensions are subject to change without notice for product improvement.