On‐board Contact for Parallel EMC Grounding: OG‐160810S
Tiny profile, board-level EMC grounding component.
Part No. | OG-160810S |
---|---|
Recommended Gap (mm) | 0.7 ~ 0.9 |
Material | Beryllium Copper |
Surface Treatment | Base: Ni
Finish: Partial Au |
Operating Temperature (°C)
Current Rating |
-40 ~ +125
3.0A |
Unit:mm
* Specifications and dimensions are subject to change without notice for product improvement.