DesignCon 2025 will be held at Santa Clara Convention Center on January 29 ~ January 30 (Wed ~ Thu), 2025

DesignCon is the premier high-speed communications and system design conference and exposition, offering industry-critical engineering education in the heart of electronics
innovation — Silicon Valley. Please join the DesignCon 2025 at the Santa Clara Convention Center January 29 ~ January 30 (Wed ~ Thu), 2025 for two days of education, exhibits, and networking. Registration has started and you can register here.

Our booth number is 1239, and please check the floor map here.

Expo days & Hours:
Wednesday, January 29, 2025: 11 a.m.–6 p.m
Thursday, January 30, 2025: 11 a.m.–6 p.m.

Location:
Santa Clara Convention Center
5001 Great America Pkwy, Santa Clara, CA 95054

DesignCon is the country’s largest gathering of chip, board, and systems designers.
For 30 years, design engineers and other industry professionals come together in Silicon Valley to search for techniques and products to handle the latest signal and power integrity challenges. These potential buyers are the reason why 93% of 2023’s
exhibitors stated that DesignCon is important for their business. – DesignCon

Santa Clara Convention Center

With technical paper sessions, panels, tutorials, and boot camps spanning 14 tracks, DesignCon’s three-day conference program provides the information you need to solve design challenges now and plan how to improve designs in the future.

Oval shaped nanocrystalline ferrite that has been tested for high vibration (ISO 16750-3
II) to accommodate for the automotive market. Stable impedance at a broad temperature range of -40C ~ +125C.

Putty does not drip even when thickly applied. Extremely useful in filling gaps with varying component heights. Very little compressive force on sensitive IC components
and PCBs. No pre-mixing required! Putty is supplied ready to dispense. Automated dispensing possible with coating machine. Silicone-free base, great for any device, especially for sensitive optical applications

Graphite Hybrid Sheet. Low thermal conductivity layer reduces the speed of heat
transfer to the graphite layer. This prevents hot spots from forming and impedes heat
reflection back to the heat source. Comes with heat-resistant double-sided tape for easy
application. Ideal for heat management on plastic housings/cases of space-conscious
electronic devices.

Dual-function thermal pad with a low-dielectric constant which helps suppress noise in
the GHz band. Soft material (Asker C 30) makes the material compliable and results in
less stress applied to the PCB as compared to harder thermal interface materials. One-
sided thin permanent PET film provides mechanical support while preventing dust and
debris from getting trapped on the tacky surface without significant effects to thermal
performance. Silicone-free base so there is no concern for siloxane outgassing or
silicone oil bleeding.

Ideal for monitoring long-term and short-term risk of hydrogen sulfide and sulfur
corrosion to electronic devices (ISO 11844-1, ANSI/ISA 71.04-2013 standard). Risk is
determined by visual inspection of the corrosion length present on the Silver Scale.