DesignCon 2024 will be held at Santa Clara Convention Center on January 30 ~ February 1 (Tue ~ Thu), 2024

DesignCon is the premier high-speed communications and system design conference
and exposition, offering industry-critical engineering education in the heart of electronics
innovation — Silicon Valley. Please join the DesignCon 2024 at the Santa Clara
Convention Center January 30 ~ February 1 (Tue ~ Thu), 2024 for three days of
education, exhibits, and networking. Registration has started and you can register here.

Our booth number is 1143, and please check the floor map here.

DesignCon is the country’s largest gathering of chip, board, and systems designers. For 29 years, design engineers and other industry professionals come together in Silicon Valley to search for techniques and products to handle the latest signal and power integrity challenges. These potential buyers are the reason why 93% of 2023’s
exhibitors stated that DesignCon is important for their business. – DesignCon

Santa Clara Convention Center

With technical paper sessions, panels, tutorials, and boot camps spanning 14 tracks, DesignCon’s three-day conference program provides the information you need to solve design challenges now and plan how to improve designs in the future.

Putty does not drip even when thickly applied. Extremely useful in filling gaps with varying component heights. Very little compressive force on sensitive IC components and PCBs. No pre-mixing required! Putty is supplied ready to dispense. Automated dispensing possible with coating machine
Silicone-free base, great for any device, especially for sensitive optical applications

Dual-function thermal pad with a low-dielectric constant which helps suppress noise in the GHz band. Soft material (Asker C 30) makes the material compilable and results in less stress applied to the PCB as compared to harder thermal interface materials. One-sided thin permanent PET film provides mechanical support while preventing dust and debris from getting
trapped on the tacky surface without significant effects to thermal performance. Silicone-free base so there is no concern for siloxane outgassing or silicone oil bleeding.
We are showcasing this new product at booth #1143, come by and take a look!

Amorphous Alloy Core with excellent magnetic saturation resistance and broadband noise suppression. Effective for EMC management when there is a large common mode noise current. Screw holes on case for secure mounting of amorphous core onto chassis/frames. UL-94 V-0 rated case with a wide operating temperature of -40°C~130°C.

Small space-saving spring contacts for EMI/EMC grounding. Can also be used as a terminal SMT contact, withstanding up to 3A of current. No tin is used in the manufacturing of the product. Therefore, there is no worries of whiskers forming and flaking which can cause electrical shorts in sensitive components. Wide operating temperature range of -40°C~130°C.

Extremely low-profile space-saving spring contacts for EMI/EMC grounding. Can also be used as a terminal SMT contact, withstanding up to 1A of current. No tin is used in the manufacturing of the product. Therefore, there is no worries of whiskers forming and flaking which can cause electrical shorts in sensitive components. Standard operating temperature range of -40°C~85°C.

Please feel free to contact us with any questions regarding the above products. There is live chat on this site.