Thermal Pad IMTH70 series have a high conductivity of 7.0 W/m*K and is available in 0.5 mm to 10 mm thicknesses.
Thermal interface materials or thermal pads are space saving solutions to managing heat. They are used to fill the gaps between heat sinks and microprocessors. Even when not seen by the naked eye, microscopic air bubbles can be present in this space between the components, which when heated can harm the long term productivity and lifespan of the entire product. Intermark’s thermal pad series are the solutions that prevent these air gaps from harming your system’s components while maintaining excellent thermal conductivity.
Intermark’s thermal products, come in a variety of different types and sizes. They come in a large range of thermal conductivities from 1.0 W/m*K up to 7.0 W/m*K. Thicknesses are also flexible from 0.25 mm and up. They also use different materials depending on the application’s requirements such as silicone and acrylic rubber. They are available with both sides being self-tacky or one side-tacky. Finally, die cutting is an option available upon request.
Standard Silicone-Base Thermal Pads TH – IMTH70 Series
IMTH70 series thermal pads have a high conductivity of 7.0 W/m*K and is available in 0.5 mm to 10 mm thicknesses.