x

Tag Archive for: Thermal Pad

June 7, 2017
07 Jun 2017

Thermal Pads at DesignCon 2017

KITAGAWA INDUSTRIES America’s thermal products use different materials depending on the application’s requirements such as silicone and acrylic rubber. They are available with both sides being self-tacky or one side-tacky. Finally, die cutting is an option available upon request. Read more

March 1, 2017
01 Mar 2017

SEMI-THERM 33rd Symposium and Exhibition in San Jose, California

SEMI THERM2017 Banner SEMI THERM 33rd Symposium and Exhibition in San Jose, California

Come visit us: SEMI-THERM 33rd Symposium and Exhibition

Expo Dates & Hours:
Mar 13(Mon) – 17(Fri)
Venue: DoubleTree by Hilton Hotel San Jose
Booth Number: 308
Official Website: semi-therm.org/

Read more

October 11, 2016
11 Oct 2016

New Product – EMPV4 for Thermal Pads and EMI Absorbers

EMI Absorber Thermal Pad EMPV4 Photo small New Product   EMPV4 for Thermal Pads and EMI Absorbers
Thermal Pad – EMPV4 Series

Silcone-free thermal interface material with EMI noise suppression

  • No siloxane outgassing concerns
  • Compliable material (ASKER C 40) that conforms to uneven surfaces
  • Excellent EMI absorber performance (μ’=13 at 10MHz)
  • High operating temperature from -40 ~ +110˚C
  • Custom profile availabe upon request (such as layering together with another silicone free thermal pad)
March 14, 2016
14 Mar 2016

SEMI THERM 2016 in San Jose, CA

SEMI THERM 2016 Banner 200x140 SEMI THERM 2016 in San Jose, CA

Come visit us: SEMI THERM 2016 in San Jose, CA!

Expo Dates & Hours:
Mar 15(Tue) 1:30pm – 6:00pm
Mar 16(Wed) 1:30pm – 6:30pm
Venue: Doubletree Hotel San Jose
Booth Number: 507
Official Website: www.semi-therm.org/
Register: Passes and Pricing

Read more

April 22, 2015
22 Apr 2015

Newsletter No. 18 – New Product Announcement: Ultra-Thin Thermally Conductive Gap Filler Film

Thermal Pad CPVT Application with Photo Newsletter No. 18   New Product Announcement: Ultra Thin Thermally Conductive Gap Filler Film

New Product Announcement

Our new product, ultra-thin thermally conductive gap filler film CPVT series, is suitable for devices where design clearance is limited in thin devices such as smartphones, tablets, and other mobile devices. Available thicknesses range from 0.1mm~0.25mm. This allows minimal load onto the PCB by choosing the appropriate thickness. This gap filler film has a side with natural tackiness and the other with a film layer to provide better workability as compared to grease. Read more

March 3, 2014
03 Mar 2014

Featured Thermal Pad: Soft (ASKER C 23) Silicone-Free – CPHS and CPHS-F Series

Thermal Pad CPHS Small Featured Thermal Pad: Soft (ASKER C 23) Silicone Free   CPHS and CPHS F Series
Thermal Pad – CPHS and CPHS-F

Soft Silicone-Free Thermal Pad – CPHS and CPHS-F Series

Soft (ASKER C 23) Silicone-Free Thermal Pad

  • Reduces the stress on the elements after mounting.
  • Silicone-free material – no siloxane outgassing or extraction
  • Highly conformable.
  • Low contact thermal resistance.
  • Suitable for vibration control as well.

For more details, click here.

February 17, 2014
17 Feb 2014

New Ultra-thin Thermal Conductive Sheet – CPVT Series

Thermal Pad CPVT Small New Ultra thin Thermal Conductive Sheet   CPVT Series
Thermal Conductive Sheet

Thermal Pad: Ultra-thin Thermal Conductive Sheet – CPVT Series

Ultra-thin, thermally conductive sheet, suitable for devices where clearance is limited.

  • Available thicknesses ranging from 0.1mm~0.25mm at every 0.05mm pitch. Load to PCB can be minimized by choosing the appropriate thickness
  • Sheet form with single-side adhesive provides better workability compared to grease
  • Suitable for thin designs of mobile devices such as smartphones, taqblets, etc

For more details, click here.

January 31, 2014
31 Jan 2014

New Thermal Interface Material(TIM) – Ceramic Heat Sink (CECD Series)

Ceramic Heat Sink CECD s New Thermal Interface Material(TIM)   Ceramic Heat Sink (CECD Series)
Ceramic Heat Sink (CECD Series)

Ceramic Heat Sink – CECD Series

Porous Ceramic Heat Sink with excellent insulation

  • Compared to traditional aluminum the combination of the larger surfacearea provided by the porous structure and higher levels of thermal radiation amounts to superior heat dissipation.
  • About 30% lighter than aluminum heat sinks
  • There is no electromagnetic radiation from the heat sink unlike conventional metallic ones

For more details, click here.

January 12, 2014
12 Jan 2014

New Thermal Pad Product – SPLK Series


Thermal Pad – SPLK Series

Thermal Pad – SPLK Series

Low permittivity thermal pad effective for suppressing radiated emissions

  • Low dielectric constant reduces the capacitive coupling effect of the heat sink.
  • Silicone-based, soft material (ASKER C 18) allows for less pressure on the heat source, such as the IC or PCB.
  • One side is tacky and the other is less tacky, which is easier to remove and handle for maintenance.

For more details, click here.

October 15, 2013
15 Oct 2013

New Thermal Pad Product: Ultra-Soft Silicone-Free Thermal Interface Material

Thermal Pad Silicon Free CPSS Small New Thermal Pad Product: Ultra Soft Silicone Free Thermal Interface Material
Thermal Pad – CPSS Series

Ultra-Soft Silicone-Free Thermal Pad – CPSS Series

Ultra-Soft (ASKER C 8) Silicone-Free Thermal Interface Material

  • Super soft and compliable material allows for less pressure on the heat source, such as the IC or PCB, when compared to a standard TIM
  • Pliability of the material allows for lower thermal resistance on an uneven surface
  • Silicone-free material – no siloxane outgassing
  • Suitable for vibration control

For more details, click here.