Standard Silicone-Base Thermal Pads – IMTH50 Series
IMTH50 series thermal pads have a high conductivity of 5.0 W/m*K and is available in 0.5 mm to 10 mm thicknesses.
Features
KITAGAWA INDUSTRIES America’s IMTH series, silicone-based thermal pads are popular items for many applications such as cell phones, laptop, routers, network servers etc.
KITAGAWA INDUSTRIES America offers a wide variety from 1.0 W/m*K up to highest 7.0 W/m*K in thicknesses from 0.5 mm up to 20 mm.
They are also the superior and longer lasting solutions in comparison to thermal grease. Thermal grease or paste can be very difficult to handle. Its liquid form makes it messy to apply, and unless one completely covers an entire surface evenly, areas with less thermal grease will have less performance.
Part Number Example: IMTH50-010
- 50= Thermal Conductivity 5W/m*K
- 010=Thickness 1.0mm thick
Structure:
| Silicon Pad |
← Polyester release film
← Inherently tacky
← Polyester release film
← Inherently tacky
← Polyester release film
IMTH50 – (5.0 W/m·K Thermal Pad)
- RoHS Compliant
*Specifications and dimensions are subject to change without notice for product improvement.
Specification
| Material | Value/Desc | Test Method |
| Binder | Silicone | - |
| Filler | Alumina | - |
| Top Release Liner | PET | - |
| Bottom Release Liner | PET | - |
| Mechanical Properties | Value/Desc | Test Method |
| Thickness (mm)1 | 0.5 to 10mm | - |
| Standard Sheet Size (mm) | 200mm x 300mm | - |
| Color:Top Release Liner | Clear | - |
| Color:Silicone Pad | Gray | - |
| Color:Bottom Release Liner | Clear | - |
| Hardness (Shore 00) | 60 +/- 10 | ASTM D 2240 |
| Specific Gravity | 3.2 | - |
| Continuous Usage Temp (deg C) | -60 to +200 | - |
| Young’s Modulus (kPa) | 45 +/- 10 | - |
| Electrical Properties | Value/Desc | Test Method |
| Dielectric Constant | 5.5@1KHz | ASTM D150 |
| Dielectric Breakdown (kV AC) | Min. 6kV AC/mm | ASTM D149 |
| Volume Resistivity (ohm meter) | 1.6×1011 | ASTM D 257 |
| Outgas | Value/Desc | Test Method |
| Total Mass Loss (wt %) | 0.052+/-0.005 | ASTM E 595 |
| Condensable (CVCM; wt%) | 0.020+/-0.002 | |
| Water Vapor Recovered (wt %) | 0.010+/-0.001 |
| Value/Desc | Test Method | |
| Thermal Conductivity (W/m*K) | 5.0 | ASTM E 1530 |
| Heat Capacity (J/g-K) | - | - |
| Flame Retardant | UL94V0 Equivalent | UL94 |
IMTH50 – (5.0 W/m·K Thermal Pad)
- RoHS Compliant
*Specifications and dimensions are subject to change without notice for product improvement.
Applications:
Thermal pads are used in a variety of electronic applications and industries including computers, laptops, tablet PCs, smart phones, routers, LEDs, solar, medical device, power supplies, wireless devices, and the automotive industry.
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