KITAGAWA INDUSTRIES America, Inc. – EMI/RFI shielding components.

Phase Change Gel Thermal Pad (CGD, CGDR)

50 degrees phase change material secures close contact with heating elements and easy and clean handling

Features

Phase change material appears to be like any normal thermal pad at room temperature, but when heated to 50° C, it transforms into a liquid to fill in any gaps between the heat sink and the heat source before becoming a solid again after cooling. It’s great for ensuring that even spaces with irregular shapes will be covered completely without the chance of leaving air gaps.

Thermal interface material for use between heating elements and heat sinks.
Low thermal resistance.
Easy and clean handling – Solid at room temperature and no need for measurement like grease.
Silicone-free material – eliminates concerns over contact failure due to siloxane gas.

Part Number:

CGD
CGDR

Phase Change Gel Thermal Pad (CGD, CGDR)

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Data Sheet (PDF)

RoHS Compliant

*Specifications and dimensions are subject to change without notice for product improvement.

Specification

Part No.	CGD	Test Method
Thickness (mm)	0.25 ±0.025, 0.5 ±0.05	-
Standard Sheet Size	200 x 200 ±2.5	-
Thermal Conductivity (W/m･K)	2	QTM Method
Color	Gray	Visual Check
Volume Resistivity (Ω∙cm)	1.0 x 10¹⁴	-
Phase change temperature (C°)	50	-
Operating Temperature	-20° – 100°	-
Carrier	N/A	-

Part No.	CGDR	Test Method
Thickness (mm)	0.25 ±0.025, 0.5 ±0.05	-
Standard Sheet Size	200 x 200 ±2.5	-
Thermal Conductivity (W/m･K)	2	QTM Method
Color	Gray	Visual Check
Volume Resistivity (Ω∙cm)	1.0 x 10¹⁴	-
Phase change temperature (C°)	50	-
Operating Temperature	-20° – 90°	-
Carrier	PET (one side)	-

Phase Change Gel Thermal Pad (CGD, CGDR)

Quote Request

Request FREE Sample

Data Sheet (PDF)

RoHS Compliant

*Specifications and dimensions are subject to change without notice for product improvement.

Properties

Phase Change:
Change Gel Thermal Pad CGD Phase Change Phase Change Gel Thermal Pad (CGD, CGDR)
The gel sheet changes to high-viscosity liquid due to the heat from IC, and fills air gap, effectively transferring the heat to heat sink to lower the temperature of heat generating element.