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Our thermal interface materials come in a variety of different types and size.

Thermal Pad (Thermal Interface Material)

As technology continues to advance, the trend toward designing smaller products with higher performance capabilities is requiring many to innovate and think of new ways of managing heat in more efficient ways. Proper thermal management is crucial to increasing or maintaining a product’s overall lifespan.

Thermal interface material(TIM) or Thermal Pad is space saving solutions to managing heat. They are used to fill the gaps between heat sinks and microprocessors. Even when not seen by the naked eye, microscopic air bubbles can be present in this space between the components, which when heated can harm the long term productivity and lifespan of the entire product. KITAGAWA INDUSTRIES America’s Thermal Pad (Thermal Interface Material) series are the solutions that prevent these air gaps from harming your system’s components while maintaining excellent thermal conductivity. They disperse heat quickly to ensure that overheating will never become an issue.

Click here for more information about Thermal Pad (Thermal Interface Material) and other thermal management components.

They are also the superior and longer lasting solutions in comparison to thermal grease. Thermal grease or paste can be very difficult to handle. Its liquid form makes it messy to apply, and unless one completely covers an entire surface evenly, areas with less thermal grease will have less performance. Overall, grease in comparison to pads has inconsistent performance throughout its structure.

KITAGAWA INDUSTRIES America’s thermal products come in a variety of different types and sizes. They come in a large range of thermal conductivities from 1.0 W/m*K up to 7.0 W/m*K. Thicknesses are also flexible from 0.25 mm and up. They also use different materials depending on the application’s requirements such as silicone and acrylic rubber. They are available with both sides being self-tacky or one side-tacky. Finally, die cutting is an option available upon request.

Thermal Pad (Thermal Interface Material) is used in a variety of electronic applications and industries including computers, laptops, tablet PCs, smart phones, routers, LEDs, solar, medical device, power supplies, wireless devices, and the automotive industry.

Thermal Design

Thermal design is to lower the temperature of the element by using heat-releasing material, and/or by transferring the heat from the heat-generating part to the cooling surface of the chassis.

Type of Thermal Interface Material

KITAGAWA INDUSTRIES America’s thermal products use different materials depending on the application’s requirements such as silicone and acrylic rubber. They are available with both sides being self-tacky or one side-tacky. Finally, die cutting is an option available upon request.

number01 Thermal Pads

im tm SPVS Thermal Pads
Silicone-Base Thermal Pad

Standard silicone-based Thermal Pad (Thermal Interface Material) is cost effective thermal management solutions. KITAGAWA INDUSTRIES America offers a wide variety from 1.0 W/m*K up to 7.0 W/m*K.

number02 Thermal Pads

im tm CPVS Thermal Pads
Silicone-Free Thermal Pad

KITAGAWA INDUSTRIES America offers a line of non-silicone based Thermal Pad (Thermal Interface Material). They are made with acrylic rubber to eliminate any worries regarding siloxane gasses.

number03 Thermal Pads

im tm CGD CGDR Series Thermal Pads
Phase Change Gel / (PCM) Change

Phase change gel appears to be like any normal Thermal Pad at room temperature, but when heated to 50° C, it transforms into a liquid to fill in any gaps between the heat sink and the heat source before becoming a solid again after cooling.

number04 Thermal Pads

Ceramic Heat Sink CECD 180x94 Thermal Pads
Special Thermal Interface Material

Ceramic Heat Sink:
Porous Ceramic Heat Sink with excellent insulation.

Thermal Heat Spreader:
Thin and flexible heat spreading sheet for superior thermal management.

Product Line of Thermal Pad

KITAGAWA INDUSTRIES America’s thermal products come in a variety of different types and sizes. They come in a large range of thermal conductivities from 1.0 W/m*K up to 7.0 W/m*K. Thicknesses are also flexible from 0.25 mm and up.


Our IMTH series silicone-based thermal pads are one of our TIM (Thermal Interface Materials) which are one of our most popular thermal management components. They are designed to withstand high temperatures (up to 200°C) and has very low outgassing compared to similar silicone-based TIM’s. KITAGAWA INDUSTRIES America offers a wide variety from 1.5 W/m*K up to 7.0 W/m*K. Our standard product is inherently tacky on both sides. We also offer options such as one-side less tacky, fiberglass reinforced and lower durometer versions.

im pd SPVS Series Thermal PadsSPVS
Flame resistant, high performance thermally conductive sheet. Silicon Free Thermal Conductive Sheet Featuring Electromagnetic Wave Absorption Properties.

Standard Silicone Base Thermal Pads IMTH Thermal PadsIMTH15 Series
IMTH15 series thermal pads have a high conductivity of 1.5 W/m*K and is available in 0.3 mm to 25 mm thicknesses.

Standard Silicone Base Thermal Pads IMTH Thermal PadsIMTH30 Series
IMTH30 series thermal pads have a high conductivity of 3.0 W/m*K and is available in 0.3 mm to 10 mm thicknesses.

Standard Silicone Base Thermal Pads IMTH Thermal PadsIMTH50 Series
IMTH50 series thermal pads have a high conductivity of 5.0 W/m*K and is available in 0.5 mm to 10 mm thicknesses.

Standard Silicone Base Thermal Pads IMTH Thermal PadsIMTH70 Series
IMTH70 series thermal pads have a high conductivity of 7.0 W/m*K and is available in 0.5 mm to 10 mm thicknesses.


Many applications today such as optical, medical, and sensor devices certain requirements preventing them from using silicone based products. To meet these demands, KITAGAWA INDUSTRIES America offers a variety of silicone-free thermal pads. We use an acrylic rubber base to eliminate any concerns of siloxane outgassing and oil-bleeding. Our silicone-free thermal pads are very soft which is beneficial for reducing applied stress on the PCB and lowering the thermal resistance.

Thermal Pad CPVH Photo small Thermal PadsCPVH Series NEW!
Soft, 3W/m・K silicone-free thermal pad for high operating temperature applications.

Thermal Pad Silicon Free CPVS Small Thermal PadsCPVS
Excellent stress relaxation property reduces the stress on the elements after mounting. Silicone-free material – no siloxane outgassing or extraction.

Thermal Pad Silicon Free CPSS Small Thermal PadsCPSS NEW!
Super soft and compliable material allows for less pressure on the heat source, such as the IC or PCB, when compared to a standard TIM.

Thermal Pad CPHS Small Thermal PadsCPHS and CPHS-F Series
Reduces the stress on the elements after mounting. Silicone-free material – no siloxane outgassing or extraction. Highly conformable.

Thermal Pad CPV Series s Thermal PadsCPV Series
Silicone-Fee Material – no siloxane outgassing or silicone extraction. Suitable for vibration control as well. UL94-VTM-0.

Thermal Pad CPVT Thermal PadsCPVT Series NEW!
Ultra-thin, thermally conductive sheet, suitable for devices where clearance is limited.

Thermal Pad and Vibration Dampener CPAG Series Thermal PadsThermal Pad and Vibration Dampener – CPAG Series NEW!
Silicone-Free, heat-conductive vibration damping sheet. Dual function thermal conductive and vibration damping material.


Dual functioning Thermal Materials

With an increasing number of applications dealing with more than one issue in the same location, our silicone-free dual functioning materials are a cost effective solution for resolving both problems at the same time. Some examples are our EMPV4 (Dual functioning Thermal pad and EMI Absorber) and CPAG (Dual functioning Thermal pad and Vibration Dampener). Upon special request, KITAGAWA INDUSTRIES America can also layer two or more of our silicone-free materials into one without trapping any air bubbles. Multiple layered products are fused together during manufacturing in such a way that the layers will not come apart.

EMI Absorber Thermal Pad EMPV4 Photo small Thermal PadsEMI Absorber & Thermal Pad – EMPV4 Series NEW!
Silcone-free thermal interface material with EMI noise suppression. No siloxane outgassing concerns. Compliable material (ASKER C 40) that conforms to uneven surfaces.

Thermal Pad and Vibration Dampener CPAG Series Thermal PadsThermal Pad and Vibration Dampener – CPAG Series NEW!
Silicone-Free, heat-conductive vibration damping sheet. Dual function thermal conductive and vibration damping material.

Change Gel Thermal Pad CGE Series Thermal PadsChange Gel Thermal Pad + EMC Dual Function CGE Series
Thin + Dual functional sheet for EMC and thermal management. Phase Change at 50degreesC to secure close contact with heating elements.


Phase Change Gel/Phase Change Materials

Our silicone-free phase change materials are great solutions for applications with limited space and are a great alternative to thermal grease. Our phase change gel is solid at room temperature and when heated to 50°C, it transforms into a viscous liquid state to fill any gaps present between the heat sink and the heat source. Then the thickness and thermal resistance are reduced without leaving any air gaps. Once it cools, the phase change material cures without losing its shape.

Phase Change Gel Thermal Pad CGD Series Thermal PadsPhase Change Gel Thermal Pad (CGD, CGDR)
50 degrees phase change material secures close contact with heating elements and easy and clean handling.

Change Gel Thermal Pad CGE Series Thermal PadsChange Gel Thermal Pad + EMC Dual Function CGE Series
Thin + Dual functional sheet for EMC and thermal management. Phase Change at 50degreesC to secure close contact with heating elements.


Special Thermal Interface Material

Our Special TIM (Thermal Interface Materials) include our Ceramic Heat Sink and Thermal Heat Spreader. The ceramic heat sink has a greater surface area due to its porous structure which allows for effective dissipation of heat.
Our cost effective aluminum heat spreader is a great solution for evenly distributing heat throughout, preventing a hot spot from occurring.

Ceramic Heat Sink CECD Thermal PadsCeramic Heat Sink – CECD Series
Compared to traditional aluminum, the combination of the larger surface area provided by the porous structure and higher levels of thermal radiation amounts to superior heat dissipation.

Heat Spreader HSD Series Thermal PadsThermal Heat Spreader – HSD Series
Thin and flexible heat spreading sheet for superior thermal management. Aluminum heat spreader material with excellent thermal conductivity (221 W/m·K).

Our Thermal Pads and Thermal Interface Materials are used as various equipment

Thermal Pad (Thermal Interface Material) is used in a variety of electronic applications and industries including computers, laptops, tablet PCs, smart phones, routers, LEDs, solar, medical device, power supplies, wireless devices, and the automotive industry.