Thermal Pad (Thermal Interface Material)
As technology continues to advance, the trend toward designing smaller products with higher performance capabilities is requiring many to innovate and think of new ways of managing heat in more efficient ways. Proper thermal management is crucial to increasing or maintaining a product’s overall lifespan.
Thermal interface material(TIM) or Thermal Pad is space saving solutions to managing heat. They are used to fill the gaps between heat sinks and microprocessors. Even when not seen by the naked eye, microscopic air bubbles can be present in this space between the components, which when heated can harm the long term productivity and lifespan of the entire product. KITAGAWA INDUSTRIES America’s Thermal Pad (Thermal Interface Material) series are the solutions that prevent these air gaps from harming your system’s components while maintaining excellent thermal conductivity. They disperse heat quickly to ensure that overheating will never become an issue.
They are also the superior and longer lasting solutions in comparison to thermal grease. Thermal grease or paste can be very difficult to handle. Its liquid form makes it messy to apply, and unless one completely covers an entire surface evenly, areas with less thermal grease will have less performance. Overall, grease in comparison to pads has inconsistent performance throughout its structure.
KITAGAWA INDUSTRIES America’s thermal products come in a variety of different types and sizes. They come in a large range of thermal conductivities from 1.0 W/m*K up to 7.0 W/m*K. Thicknesses are also flexible from 0.25 mm and up. They also use different materials depending on the application’s requirements such as silicone and acrylic rubber. They are available with both sides being self-tacky or one side-tacky. Finally, die cutting is an option available upon request.
Thermal Pad (Thermal Interface Material) is used in a variety of electronic applications and industries including computers, laptops, tablet PCs, smart phones, routers, LEDs, solar, medical device, power supplies, wireless devices, and the automotive industry.
Silicone-Base Thermal Pad (Thermal Interface Material) TH
Silicone-based Thermal Pad (Thermal Interface Material) is becoming an industry standard for thermal management solutions for their durability to withstand high temperatures up to 200°C. KITAGAWA INDUSTRIES America offers a wide variety from 1.0 W/m*K up to 7.0 W/m*K. While some may be concerned with the use of silicone, outgas levels are extremely low. They come with the options of two sides self-tacky and one side self-tacky. Thickness are flexible ranging from 0.5mm and up.
Standard Silicone-Base Thermal Pad (Thermal Interface Material) TH
Standard silicone-based Thermal Pad (Thermal Interface Material) is cost effective thermal management solutions. KITAGAWA INDUSTRIES America offers a wide variety from 1.0 W/m*K up to 7.0 W/m*K.
Silicone-Free Thermal Pad (Thermal Interface Material)
Many optical, medical, and sensor applications cannot allow silicone particles to be located within their enclosures. To meet the needs of these industries, KITAGAWA INDUSTRIES America offers a line of non-silicone based Thermal Pad (Thermal Interface Material). They are made with acrylic rubber to eliminate any worries regarding siloxane gasses. These are available in thermal conductivities between 2.0 W/m*K. Like silicone based Thermal Pad (Thermal Interface Material), self-tackiness on both sides and one side self-tackiness are available as options. Available thicknesses range from 0.5 – 2.0 mm.
Thermally Conductive EMI Absorber DuAL
With compact applications suffering from both thermal and EMI problems in the same area, our dual functioning materials can solve both issues at the same time. These silicone free materials vary between 1.1 W/m*K (EMPV), 1.8 W/m*K (EMPV2). They can save time and cost by using one material as the solution for both issues.
Phase Change Gel/Phase Change Materials (PCM) Change
Phase change material appears to be like any normal Thermal Pad (Thermal Interface Material) at room temperature, but when heated to 50° C, it transforms into a liquid to fill in any gaps between the heat sink and the heat source before becoming a solid again after cooling. It’s great for ensuring that even spaces with irregular shapes will be covered completely without the chance of leaving air gaps.
Ceramic Heat Sink – CECD Series NEW!
Porous Ceramic Heat Sink with excellent insulation. Compared to traditional aluminum the combination of the larger surfacearea provided by the porous structure and higher levels of thermal radiation amounts to superior heat dissipation. About 30% lighter than aluminum heat sinks. There is no electromagnetic radiation from the heat sink unlike conventional metallic ones.
Thermal Heat Spreader – HSD Series NEW!
Thin and flexible heat spreading sheet for superior thermal management. Aluminum heat spreader material with excellent thermal conductivity (221 W/m·K). Spreads heat away from hot spots to cooler areas. Prevents components from overheating. Optional electrically insulating PET layer can be applied. Ideal thermal solution for hot spots on space conscious applications such as mobile devices, tablets, routers, browser boxes, etc.