INTERMARK USA’s thermal products, Qoolite™ come in a variety of different types and sizes, including the popular item Qoolite™ TH that is available in a large range of thermal conductivities from 1.0 W/m*K up to 7.0 W/m*K. They are available with both sides being self-tacky or one side-tacky. Finally, die cutting is an option available upon request.
As technology continues to advance, the trend toward designing smaller products with higher performance capabilities is requiring many to innovate and think of new ways of managing heat in more efficient ways. Proper thermal management is crucial to increasing or maintaining a product’s overall lifespan.
Thermal interface materials or thermal pads are space saving solutions to managing heat. They are used to fill in the gaps between heat sinks and microprocessors. Even when not seen by the naked eye, microscopic air bubbles can be present in this space between the components, which when heated can harm the long term productivity and lifespan of the entire product. INTERMARK USA’s thermal pad series are the solutions that prevent these air gaps from harming your system’s components while maintaining excellent thermal conductivity. They disperse heat quickly to ensure that overheating will never become an issue.
Thermal pads are used in a variety of electronic applications and industries including computers, laptops, tablet PCs, smart phones, routers, LED applications, solar, medical device, power supplies, wireless devices, and the automotive products.
INTERMARK USA offers a variety of thermal pads and other products for thermal management.
Thermal Pads and Thermal Management Selection.