Come visit us: DesignCon 2016 in Santa Clara, CA!
KITAGAWA INDUSTRIES America is showcasing variety of new materials including the MG-03A EMI absorber, which is a very thin and flexible electromagnetic noise suppression sheet.
Besides the MG-03A EMI absorber, we also cover absorbers for RFID/NFC applications, high GHz frequency EMI absorbers, as well as an absorber with thermal management function. For shielding materials, our new conductive Silicone Gasket (highly reliable for environmental shielding and EMI noise shielding) is also displayed.
For thermal management materials, we offer a wide selection of thermal interface materials with higher thermal conductivity.
We have some additions to the current onboard contact (SMT type grounding contacts) to product line as well.
DesignCon is the premier conference for chip, board and systems design engineers in the high speed communications and semiconductor communities. Now in its 21st year, DesignCon offers state-of-the-art design methodologies, applications and technologies, as well as unparalleled networking opportunities.
Taking place annually in Silicon Valley, DesignCon was created by engineers for engineers and remains the largest gathering of chip, board and systems designers in the country. Combining technical paper sessions, tutorials, industry panels, product demos and exhibits, DesignCon brings engineers the latest theories, methodologies, techniques, applications and demonstrations on PCB design tools, power and signal integrity, jitter and crosstalk, high-speed serial design, test and measurement tools, parallel and memory interface design, ICs, semiconductor components and more.