Come visit us at DesignCon 2013 in Santa Clara!
Exhibit Date & Time:
January 29-30, 2013 / 12:30 pm – 6:00pm
Venue: Santa Clara Convention Center
Booth Number: 222
INTERMARK USA attends this event to answer questions, provide information, and to showcase our new products to customers and vendors alike. Keep up to date with our latest news and information.
Updated: Jan 8, 2013
Intermark USA Inc is showcasing variety of new materials including the MG-10A EMI absorber, which is a very thin and flexible electromagnetic noise suppression sheet.
Besides the MG-10A EMI absorber, we also cover absorbers for RFID/NFC applications, high GHz frequency EMI absorbers, as well as an absorber with thermal management function. For shielding materials, our new conductive Silicone Gasket (highly reliable for environmental shielding and EMI noise shielding) is also displayed.
For thermal management materials, we offer a wide selection of thermal interface materials with higher thermal conductivity.
We have some additions to the current onboard contact (SMT type grounding contacts) to product line as well.
Go to the DesignCon 2013 website. | Registration Form
The DesignCon 2013 expo floor features the industry’s top design tool vendors.
“Each year, the semiconductor and electronic design engineering communities look to the DesignCon exhibit floor as THE place to discover the latest technologies and developments in the industry.
The DesignCon 2013 expo features more exhibitors than any other industry event this winter, offering engineers and engineering managers a unique opportunity to learn about the latest technologies & solutions.” – DesignCon 2013 Expo